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3D XPoint Films Senior/Principle Process Development Engineer (Lehi Tech Center)

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Location
Lehi, UT
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Req. ID: 120387 

This position will be based in Micron’s joint venture facility in Lehi, UT.   As a Senior or Principle Films Process Development Engineer in the Technology Development Group, you will work closely with F4 and JDP team in industry-leading semiconductor process technology. In this position you will be responsible for the evaluation of new hardware platforms, develop new deposition processes, drive Films Process technology roadmap and partner with vendors to develop processes for CMOS and Interconnect modules for next generation 3DXP nodes. You will act as Films key point of contact for your module to enable early array module process transfer from F4 to HVM and in collaboration with Equipment Engineers, Process Engineers , Process Integration Engineers from LTC and Fab 2 perform rigorous Films process characterization, optimization,and drive execution of critical Films projects post transfer to meet technode gate and milestone criteria.

Responsibilities:

Perform fundamental research, Films process development, and generation of intellectual property

Films process characterization, optimization, design and troubleshooting

Organize well designed experiments to understand the interaction between process and hardware parameters and use this knowledge to optimize for best performance

Develop and evaluate innovative solutions to improve process margins

To work with various integration/structural and device impacts and constraints to enable functional and reliable device

To derive insightful inferences from the analysis of physical and electrical data and utilize the understanding to modify processes to meet the device requirements

Development of new processes, including evaluation of new hardware platforms

Qualifying conversions and new processes, defining process margin

Transfer processes to pilot production and high volume manufacturing facilities

Drive TD Films Process technology roadmap for CMOS and Interconnect Module

Required Skills:

An understanding of the interactions between process and hardware and be able to leverage this knowledge.

An understanding of chemical kinetics and their direct application to diffusion, CVD, and Automatic layer Depostion (ALD) deposition processes in various deposition reactors.

An understanding of various types of physical film analysis techniques such as Secondary Ion Mass Spectroscopy (SIMS), X-ray Photoelectron Spectroscopy (XPS), Energy Dispersive Spectroscopy (EDS), Scanning Electron Microscopy or Microscope (SEM), Transmission Electron Microscopy or Microscope (TEM), Rutherford Bascattering Spectronetry (RBS), Electro Probe Micro Analysis (EPMA), Spectroscopic Ellipsometry (SE).

An understanding of various thin film electrical evaluation methods and techniques such as leakage, impedance, capacitance.

An understanding of the various integration/structural impacts and constraints related to oxidation, nitridation, and anneal processes in memory devices.

The ability to evaluate and make insightful inferences from large amounts of various types of data, such as physical & electrical analysis.

The ability to interact and collaborate with integration engineers to develop robust film and related module as well as deploy the process to internal customers in R&D and the production fabs.

The ability to analyze oxide quality using CV methods, mercury probe methods, Quantox, EOT (Effective Oxide Thickness or simply electrical dielectric thickness), probe data and reliability data Probe Date & Reliability Data (TDDB).

Familiarity with Metal-Oxide-Silicon Capacitor (MOSCAP) device flow and electrical analysis techniques and data interpretation.

Full understanding of chemistry/physics of oxidation processes, including stoichiometry, interface effects, defect/trap formation and engineering.

Also must be willing to work weekends or evenings, if necessary.

Understanding in the principles of Films deposition (PECVD, LPCVD) and associated hardware

Rudimentary understanding of process control and Statistical Process Control (SPC)

An understanding of solid state devices

Strong aptitude for research and development with interest and capability to create production worthy technologies.

Be a critical thinker and at the same time be a team player and handle constructive criticism from other team members and leverage input to drive projects forward

Possess a high degree of self-motivation, goal orientation and the ability to aggressively focus on solving problems and to learn new skills.

Have the ability to plan and execute well-designed experiments and report results in clear concise reports.

Demonstrate dependability and willingness to take on responsibilities.

Expertise in new process/tool technology assessment

Ability to work on multiple projects and work through cross-disciplinary and cross-organizational logistical issues.

Strong communication and reporting skills both written and verbal.

Proactive approach to problem/project management and good problem solving skills

Strong teamwork skills.

Requirements:

PhD in Chemistry, Material Science, Physics, Chemical Engineering, Mechanical Engineering or related field of study with 3 plus years” experience OR

MS/BS degree in Chemistry, Material Science, Physics, Chemical Engineering, Mechanical Engineering or related field of study with 5 plus years” experience

We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.

To request assistance with the application process, please **** (or 208-368-4748).

Keywords:  Lehi || Utah (US-UT) || United States (US) || Technology Development || Experienced || Regular || Engineering || #LI-KV1 ||

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Company info

Micron Technology, Inc.
Website : http://www.micron.com/

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